Features

• • • Complete Fingerprint Sensor Module:

      • FAP30 Sensor
      • iG101 Sensor Controller
      • Module Size: 45mm x 28 x TBD
      • Connect Used: 832JDXXPTX-42 (10pin/pitch 1.0mm)
      • Housing Material: Steel
      • ESD Tolerance: TBD

    • FAP30 Sensor:

      • Pixel: 400 x 500
      • Pixel Size: 50μm x 50μm
      • Spatial Resolution: 598dpi
      • Sensing Area: 20mm x 25mm
      • Sensor Pad Size: 0.8 x 0.8mm
      • Sensor Package Size: 25mm x 33mm x TBD

    • iG101 Controller

      • SPI Clock: 8MHz
      • Package: QFN88
      • Package Size: 10mm x 10mm x 0.85mm

    • Power Consumption:

      • Total Supply Current: TED
      • Standby Current: TBD

    • Environmental Specification

      • Operating temperature: -20ºC to + 70°C
      • Storage temperature: -40°C to +125°C
      • storage/operating humidity: 5% to 93% RH without condensation
      • RoHS compliant and low-halogen