MFC-1400
FAP30 400 x 500 Pixel Fingerprint Module
Features
Complete Fingerprint Sensor Module:
- FAP30 Sensor
- iG101 Sensor Controller
- Module Size: 45mm x 28 x TBD
- Connect Used: 832JDXXPTX-42 (10pin/pitch 1.0mm)
- Housing Material: Steel
- ESD Tolerance: TBD
FAP30 Sensor:
- Pixel: 400 x 500
- Pixel Size: 50μm x 50μm
- Spatial Resolution: 598dpi
- Sensing Area: 20mm x 25mm
- Sensor Pad Size: 0.8 x 0.8mm
- Sensor Package Size: 25mm x 33mm x TBD
iG101 Controller
- SPI Clock: 8MHz
- Package: QFN88
- Package Size: 10mm x 10mm x 0.85mm
Power Consumption:
- Total Supply Current: TED
- Standby Current: TBD
Environmental Specification
- Operating temperature: -20ºC to + 70°C
- Storage temperature: -40°C to +125°C
- storage/operating humidity: 5% to 93% RH without condensation
- RoHS compliant and low-halogen
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